The Density Imperative for Artificial Intelligence & HPC
The rise of Generative AI and High-Performance Computing (HPC) workloads has pushed server power density to extreme levels, commonly reaching 50 kW to 120 kW per rack. Traditional air-cooled data center designs (based on 5-10 kW) can no longer efficiently manage this heat, leading to high PUEs, failure risks, and strict limits on hardware evolution. The challenge is to fundamentally redesign the energy and cooling architecture to ensure the performance of GPU and AI chips without compromising efficiency.
To ensure the excellence of your designs, our teams hold the CDCDP (Certified Data Centre Design Professional) certification, a globally recognized standard for optimized data center design.
The EDDU Energy Solution: Liquid-Ready and Heat-Ready Design
EDDU Energy specializes in optimizing energy architecture, cooling, and density to create AI-ready, low-carbon digital infrastructures. Our approach emphasizes liquid cooling solutions (Direct-to-Chip and Immersion) to remove over 70% of the heat directly at the source. We design a « Heat-Ready » infrastructure capable of delivering waste heat at high temperatures for reuse, while ensuring a minimal PUE (close to 1.02) and maximum flexibility for future deployments of power-hungry chips. Our CDCDP-certified expertise guarantees designs that are not only high-performing but also fully compliant with international best practices for efficiency and redundancy.
💡 Did You Know?
As rack densities soar with AI clusters, air cooling alone won’t cut it, liquid cooling is now stepping into the limelight.
The Components of an AI-Ready Data Center
01 / High-Density Electrical Architecture
Design of the electrical distribution to support loads of 40 kW+ per rack. Optimization of systems (UPS, PDU) to minimize losses and maximize energy conversion efficiency.
02 /Advanced Liquid Cooling
Integration of Direct-to-Chip (DTC) or Immersion Cooling solutions to manage the enormous heat generated by GPU and HPC clusters, ensuring hardware stability and longevity.
03 /CDCDP Certified Optimization
Our design teams are CDCDP certified, ensuring the highest standards of availability, scalability, and energy efficiency are met from the initial concept phase.
04 /PUE & ERE Maximization
Design focused on achieving a maximal Energy Reuse Effectiveness (ERE) value (ideally close to 1.0) and a low PUE. The cooling system is engineered to allow a high water outlet temperature (30°C–85°C), essential for effective heat monetization.
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